The Heat Dissipation Design Of Sealed Products Has Always Been A Long-Standing Heat Dissipation Problem In Communications, Military, Industrial Control And Other Industries. The Prominent Contradictions Are Mainly Reflected In:

1. The Conflict Between Narrow Product Space And Increasing Power Consumption

2. Balance Between Product Weight, Space Volume And Heat Dissipation Requirements

3. The Contradiction Between Surface Temperature Distribution And Heat Dissipation Capacity Of Sealed Products

It Can Be Seen That The Heat Dissipation Design Must Be Integrated With Many Factors Such As Structure, Appearance, Weight, Etc. Because Of This, The Heat Dissipation Design Directly Determines The Performance And Development Of The Product.

In View Of The Outstanding Problems Of Sealed Products, Our Main Ideas In Heat Dissipation Design Are:

1. Select A Heat Exchange Solution That Is Suitable For The Product And Meets The Heat Dissipation Requirements.

2. Try To Use Various Thermal Conduction Technologies To Conduct Heat Out

3. If Conditions Permit, The Product Shell Can Be Used To Dissipate Heat To The Maximum Extent.

4. Contact Thermal Resistance Is Very Important

The Following Introduces The Heat Dissipation Design Of A Typical Sealed Product:

The Operating Environment Temperature Of This Sealed Product Is: 55℃, Natural Convection Heat Dissipation, The Main Heating Chip Power: IC1-27W; IC2-6W; IC3-4.0W.

This Heat Dissipation Solution Uses Heat Pipe Technology To Conduct Heat From The Internal Chip Position To The Product Shell For Heat Dissipation. The Design Results Can Meet Customer Requirements.